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Product
Product: Layer 2
Product: Layer 4
Product: Layer 6
Number of Boards
Length (mm)
Width (mm)
Material
FR4
For standard applications the classical FR4 material is sufficient
TG150
For improved thermo-mechanical properties
TG170
When heat dissipation of a component is higher than normal
FR4
TG150
TG170
Silkscreen
Silkscreen is the text on the PCB
Black
White
Material Thickness (mm)
0.4
0.6
0.8
1.0
1.2
1.6
2.0
2.4
Drill size (mm)
0.20
0.25
0.30
Surface
Lead Free HASL
The cheapest finish available and a good choice for general-purpose boards. One downside to HASL is that the meniscus of the solder causes the edges of pads to be slightly rounded. Surface-mount parts do not sit as flat as they would on an ENIG board
Immersion Tin
Absolutely flat, good for fine pitch, good for SMD, good for press-fit but also has a quick oxidation rate
Immersion AU
The gold layer is very thin and not intended to provide the main structure of the track, it just acts as a protective coating for the nickel to prevent it tarnishing before it's soldered. Gold is extremely resistant to corrosion so ENIG has several good points: it can be touched with bare fingers without tarnishing, has a very long shelf life, and the pads / tracks are very flat and square-edged - something that can be important for fine-pitch surface-mount parts
Immersion AG
This circuit board surface is very similar to immersion tin, with better properties for oxidation and contact applications
Immersion Tin
Immersion Au - Gold 1U
Immersion Au - Gold 2U
Immersion Au - Gold 3U
Immersion Ag - Silver
Lead Free HASL
Impedence Control
No
If the trace is less than ~1/10 of the electrical length (rise time / propagation delay) then impedance control is not important
Yes
Yes -If the trace is greater than ~1/10 of the electrical length (rise time / propagation delay) ensuring that no errors, noise occurs
Yes
No
Copper Thickness
The thickness along with the width of the trace is the determining factor in the amount of current the circuit can carry. The thickness and width of the copper trace is also used in impedance calculations of high speed and RF circuitry.
0.5oz/17.5um
Low current applications.
1.0oz/35um
Default thickness.
2.0oz
For high current applications.
3.0oz
High power applications.
0.5 oz / 18 um
1.0 oz / 35um
2.0 oz / 70 um
3.0 oz / 105 um
Lead Time Days
5
6
7
8
9
10
Soldermask Colour
Soldermask is the colour of the PCB
Green
Black
Blue
Red
Additional PCB Design
Does the panel contain more than one PCB design?
Select if applicable
Plus 1
Plus 2
Plus 3
Plus 4
Attachment
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